| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a means for preventing occurrence of stress in a bonding portion between a semiconductor element and a semiconductor package for packaging the semiconductor element, due to a difference in linear thermal expansion coefficients between the both, and preventing a crack, etc., in packaging the semiconductor element even when a semiconductor element of a low strength is used. <P>SOLUTION: The package for a semiconductor device is provided with a multilayer laminate 20 formed by alternately laminating a plurality of conductor layers and insulating resin layers at least two insulating resin layers including a first layer 20g as the uppermost layer and a second layer 20h as a layer next to the uppermost layer which are laminated and formed on the upper surface of the laminate; and a semiconductor element packaging section for packaging a semiconductor element on the upper surface of the first layer. The first layer is composed of an insulating resin having a linear thermal expansion coefficient not more than the linear thermal expansion coefficient of the semiconductor element to be packaged, and the second layer is composed of a material having a low Young's modulus and a high expansion rate. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
