| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat treatment apparatus that can easily convey and transfer a boat for holding a semiconductor wafer because a thermocouple for temperature profiling is not obstructive in case when temperature profiling is conducted while the boat and the semiconductor wafer are kept being inserted in a process tube, so as to uniformly heat the semiconductor wafer, and to provide a method of acquiring heating condition in the heat treatment apparatus. SOLUTION: The heat treatment apparatus 30 is provided with a boat 2 holding a semiconductor wafer 1 and a cantilever paddle 3 wherein a fixing jig 11 is provided to hold a thermocouple protective tube 16 for temperature profiling with a built-in thermocouple 9 for temperature profiling at a position having a specified distance from the semiconductor wafer 1 and the boat 2 while the boat 2 holding the semiconductor wafer 1 is being loaded. While the boat 2 and the semiconductor wafer 1 are being inserted in a horizontal diffusion furnace 20, the temperature profiling is conducted, and a heater 5 is controlled according to the obtained temperature profile. COPYRIGHT: (C)2008,JPO&INPIT
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