发明名称 TEMPERATURE SETTING METHOD OF HEAT TREATMENT PLATE, PROGRAM, COMPUTER-READABLE RECORDING MEDIUM RECORDING THE PROGRAM, AND TEMPERATURE SETTING DEVICE OF HEAT TREATMENT PLATE
摘要 PROBLEM TO BE SOLVED: To optimize and stabilize a timing of setting the temperature of a hot plate. SOLUTION: The hot plate of a PEB (Post Exposure Baking) device is segmented into a plurality hot plate regions and a temperature can be set for each of the hot plate regions. Temperature compensation values for controlling the temperature in the plane of the hot plate can each be set for each of the hot plate regions of the hot plate. First, the line width in a wafer plane after a lithographic step is measured (S1). Then, the in-plane inclination Z of the measured line width is decomposed into a plurality of in-plane inclination components Z<SB>i</SB>using the Zernike polynominal (S2). In-plane inclination components Za<SB>i</SB>improvable by changing a temperature compensation value are extracted from the plurality of calculated in-plane inclination components Z<SB>i</SB>, and the extracted components are summed to calculate an in-plane inclination Za capable of improving the measurement line width in the wafer plane (S3). Only when the size of the improvable in-plane inclination Za exceeds a predetermined threshold value L, the setting of the temperature compensation value of each of the hot plate regions of the hot plate is changed (S6). COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008117915(A) 申请公布日期 2008.05.22
申请号 JP20060299295 申请日期 2006.11.02
申请人 TOKYO ELECTRON LTD 发明人 SHIROSAKA MEGUMI;SHINOZUKA SHINICHI;OGATA KUNIE
分类号 H01L21/027;H05B3/00;H05B3/68 主分类号 H01L21/027
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