| 摘要 |
A semiconductor device includes a resin package, a lower pad embedded in the package, an upper pad embedded in the package at a distance from the lower pad, a lower semiconductor element bonded to the lower pad, and an upper semiconductor element bonded to the upper pad and facing the lower semiconductor element. The lower surface of the lower pad is exposed at the bottom surface of the package, while the upper surface of the upper pad is exposed at the top surface of the package.
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