DEVICE ASSEMBLY

摘要

The invention relates to a device assembly comprising a housing that surrounds a receiving chamber, in which electrical components are held on at least two component supports. A cooling device having at least one heat exchanger is associated with the component support. Said cooling device guides a coolant flow through the component support and the component supports are arranged behind each other in the direction of flow of the coolant flow. According to the invention, in order to produce said type of device assembly that can effectively cool the individual component supports with a constantly sufficient cooling power level, the heat exchanger is arranged in the region between both component supports that are arranged behind each other, and the airflow flowing from the component support arranged in the direction of flow in front of the heat exchanger is at least partially absorbed and cooled, such that the coolant flow is at least partially guided to the second component support arranged in the direction of flow behind the heat exchanger.