发明名称 |
Tip cap hole brazing method |
摘要 |
<p>A tip cap hole is loaded with a first composition comprising particles of a first alloy having a solidus temperature above the brazing temperature. The first composition is covered with a second composition comprising particles of a second alloy having a liquidus temperature below the brazing temperature. The second composition is heated to the brazing temperature to cause particles of the second alloy to melt to form a liquid of the second alloy which is carried into spaces between the particles of the first alloy by capillarity. The liquid of the second alloy is cooled to form a solid securely bonding the particles of the first alloy. By weight, the second alloy has no more than 1% B and from 3% to 11% Si. The first alloy has Cr and at least about 5% Al, at least about 0.5% Hf, no more than 0.5% Ti. <IMAGE></p> |
申请公布号 |
EP1093879(B1) |
申请公布日期 |
2008.05.21 |
申请号 |
EP20000309056 |
申请日期 |
2000.10.16 |
申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
BUDINGER, DAVID EDWIN;GALLEY, RONALD L.;WUSTMAN, ROGER DALE;CLARKE, JONATHAN PHILIP |
分类号 |
B23K1/00;F01D5/18;B23K35/02;B23K35/14;B23K35/30;F01D5/20 |
主分类号 |
B23K1/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|