发明名称 |
Multi-layer printed wiring board including an alignment mark as an index for a position of via holes |
摘要 |
A multi-layer printed wiring board includes a board covered with a conductor layer, an interlayer insulating resin layer, an etched metal film on the interlayer insulating resin layer, and a via hole. The interlayer insulating resin layer has a fibrous substrate. The via hole has an electrolytic plated film and an electrolessly plated film and connects the conductor layer of the board and the etched metal film.
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申请公布号 |
US7375289(B2) |
申请公布日期 |
2008.05.20 |
申请号 |
US20060331268 |
申请日期 |
2006.01.13 |
申请人 |
IBIDEN CO., LTD. |
发明人 |
HIRAMATSU YASUJI;ASAI MOTOO;HIROSE NAOHIRO;KARIYA TAKASHI |
分类号 |
H05K1/11;H01R12/04;H05K1/02;H05K3/00;H05K3/46 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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