| 摘要 |
An electroplating apparatus comprising a plating jig is provided to form a coating film with a uniform thickness inside and between electronic parts having a plurality of leads extending from one side face of a cap part thereof, an electroplating method using the apparatus, and a plating jig used in the apparatus is provided. In a plating jig(10) for supporting electronic parts(18) as electroplating objects such that the electronic parts having a plurality of leads(18b) extending from one side face of a cap part(18a) thereof are positioned on the plating jig at the position opposite to a first anode plate immersed into an electroplating solution of a plating pot, the plating jig comprises: a cathode part(22) which is formed in a metal member containing a magnet(20), and which is connected to a cathode of a power supply for electroplating; a second anode plate(26) which is inserted between insulation layers(24a,24b) at the first anode plate side of the cathode part, and which is connected to an anode of the power supply; and concave parts(28) which pass through the insulation layers and the second anode plate, which have a cathode face(22a) of the cathode part exposed to bottom faces thereof, which have an anode face(26a) of the second anode plate exposed and inserted along inner wall surfaces thereof such that front ends of the leads of the electronic parts contacting with the bottom faces are adsorbed by magnetism of the magnet, and to which the electronic parts are supported.
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