| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board having a favorable electrical reliability in which a crack is unlikely to occur at a connection interface of via conductors even though the number of via conductors in series, which constitutes the stacked via, gets larger than that of a conventional wiring board. SOLUTION: The wiring board 1A includes: a core board CB in which a through-hole conductor 21 is formed along an inner wall of a through hole 21H which penetrates a plate-like core material 2 in the thickness direction of the core board and a filler 3 is charged into the through hole; and wiring laminate portions L1 and L2 formed in such a manner that conductor layers (M11 to M15, M21 to M25) and layer-shaped interlayer insulating materials 4 (B11 to B14, B21 to B24) are alternately laminated on a major plane of the core board CB, and via conductors 5 used for an electrical connection between the conductor layers is embedded in the interlayer insulating materials 4, wherein the via conductors 5 embedded in each interlayer insulating material 4 are stacked in a series of four or more layers in the thickness direction of the core board and constituting a stacked via 5S which is electrically connected to the through hole conductor 21, and wherein the interlayer insulating material 4 is made of a resin material having a linear thermal expansion coefficient of 35 ppm/K or more to 50 ppm/K or less. COPYRIGHT: (C)2008,JPO&INPIT |
