Substrate Processing Apparatus and Method

摘要

The substrate processing apparatus has substrate holding mechanisms ( 14 ) for holding the substrate (W) under a holding force which is changed according to a rotational speed of the substrate holding mechanisms ( 14 ), a substrate rotation mechanism ( 22 ) for rotating the substrate holding mechanisms ( 14 ) to rotate the substrate (W) held by the substrate holding mechanisms ( 14 ), and a treatment liquid supply mechanism ( 12, 15, 19 ) for supplying a treatment liquid to a desired portion of the substrate (W) held by the substrate holding mechanisms ( 14 ).