发明名称 SUPPORTING MECHANISM OF SOLID-STATE IMAGING ELEMENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a supporting mechanism fastening a solid-state imaging element to an imaging optical system which prevents deterioration of a photographed image by effectively cooling the solid-state imaging element. <P>SOLUTION: The supporting mechanism of the solid-state imaging element includes: a first metal part which is fastened with a light emitting unit of an imaging optical system, and a second metal part which integrally fastens the solid-state imaging element and an endothermic plate sticking on nearly entire plane of the solid-state imaging element and a non-imaging plane side of the solid-state imaging element, a bonding part which melt-bond the metal parts so that a focusing position of an image and an incident direction of an optical axis of an imaging optical system are properly held, and a heat dissipation plate which radiates heat generated by the solid-state imaging element using conductive heat transfer from the endothermic plate in close contact with entire plane of the non-imaging plane to a camera chassis. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008109225(A) 申请公布日期 2008.05.08
申请号 JP20060287925 申请日期 2006.10.23
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 MATSUNAGA HIROKI
分类号 H04N5/225;G03B17/02;H04N5/335 主分类号 H04N5/225
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