| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of forming a via by a printing method preventing a pressure by contact of a printing plate from being applied to a material to be printed and easy to control a via diameter. SOLUTION: The method of forming the via includes a step of applying conductive ink on a desired position on a surface of a wiring pattern 12 provided on a substrate 11 by a non-contact printing method such as an ink jet or dispenser method, thereby forming the via 13 having a protrusion 13a around its periphery to obtain a cross section including the periphery protruding more than the center. COPYRIGHT: (C)2008,JPO&INPIT
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