| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a bump forming method using a resin film as a mask, which facilitates the elimination of the resin film to enable the highly precise formation of bumps. <P>SOLUTION: The bump forming method includes a step of forming the resin film 12 on a surface of a board 10 bearing electrodes 11 formed thereon, a step of forming openings 12a on the resin film 12 to expose the electrodes 11, a step of filling the openings 12a with a bump forming material 13 containing a plurality of metals having different melting points, a step of heating the bump forming material to temperatures ranging from the lowest of the melting points of the metals or higher to lower than the highest of the melting points of the metals, a step of cooling the bump forming material to a temperature lower than the lowest of the melting points, and a step of eliminating the resin film 12 from the board 10 and then heating the board 10 to a temperature of the highest of the melting points or higher without mounting the board 10 on a bonding object. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
