发明名称 METHOD OF FORMING A PHOTORESIST PATTERN
摘要 <p>A method for forming a photoresist pattern is provided to coat a subsequentially formed layer without causing defects by performing a cleaning process for converting the surface of a hard mask layer including an SOG(spin on glass) material into a hydrophilic material. A preliminary hard mask layer including carbon as an SOG material can be formed on a substrate. A hard mask layer including a SOG material is formed on the resultant structure(S100). A cleaning process for surface treatment is performed to make the surface of the hard mask layer have a hydrophilic property(S110). An ARC(anti-reflective coating) is formed on the hard mask layer(S120). A photoresist layer is formed on the ARC(S130). The photoresist layer is patterned to form a photoresist pattern(S140).</p>
申请公布号 KR20080038986(A) 申请公布日期 2008.05.07
申请号 KR20060106585 申请日期 2006.10.31
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 PARK, KYOUNG SIL;LEE, CHANG HO;LEE, HONG;KIM, DO YOUNG;CHOI, NAM UK;LEE, JUNG HOON;KIM, YOUNG HOON;RYU, JIN A;KIM, MYUNG SUN;YANG, JOO HYUNG;LEE, MYUNG SUK
分类号 H01L21/027 主分类号 H01L21/027
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