发明名称 |
Method for selective deposition of a thin self-assembled monolayer |
摘要 |
A method for selective deposition of self-assembled monolayers to the surface of a substrate for use as a diffusion barrier layer in interconnect structures is provided comprising the steps of depositing a first self-assembled monolayer to said surface, depositing a second self-assembled monolayer to the non-covered parts of said surface and subsequently heating said substrate to remove the first self-assembled monolayer. The method of selective deposition of self-assembled monolayers is applied for the use as diffusion barrier layers in a (dual) damascene structure for integrated circuits. |
申请公布号 |
US7368377(B2) |
申请公布日期 |
2008.05.06 |
申请号 |
US20050296033 |
申请日期 |
2005.12.07 |
申请人 |
INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM (IMEC)VZW;TEXAS INSTRUMENTS INC. |
发明人 |
WHELAN CAROLINE;SUTCLIFFE VICTOR |
分类号 |
H01L21/4763 |
主分类号 |
H01L21/4763 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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