发明名称 POLISHING HEAD AND POLISHING APPARATUS
摘要 <p>A polishing head is provided with an annular rigid ring (12); a rubber film (13) bonded on the rigid ring with uniform tensile strength; a middle plate (14) connected to the rigid ring to form a space with the rubber film and the rigid ring; and an annular template (16), which is concentrically arranged with the rigid ring at the periphery of a lower surface section of the rubber film and has an outer diameter larger than the inner diameter of the rigid ring. Pressure in the space can be changed by a pressure adjusting mechanism (17). The polishing head holds the rear surface of a work (W) on the lower surface section of the rubber film and polishes the surface of the work by bringing the surface of the work slidably into contact with a polishing cloth adhered on a platen. The inner diameter of the template is smaller than that of the rigid ring, and a ratio of a difference between the inner diameter of the rigid ring and that of the template to a difference between the inner diameter and the outer diameter of the template is 26% or more but not more than 45%. Thus, the polishing head or the like is provided for stably obtaining constant planarity.</p>
申请公布号 WO2008050475(A1) 申请公布日期 2008.05.02
申请号 WO2007JP01137 申请日期 2007.10.18
申请人 SHIN-ETSU HANDOTAI CO., LTD.;FUJIKOSHI MACHINERY CORP.;MASUMURA, HISASHI;KITAGAWA, KOJI;MORITA, KOUJI;KISHIDA, HIROMI;ARAKAWA, SATORU 发明人 MASUMURA, HISASHI;KITAGAWA, KOJI;MORITA, KOUJI;KISHIDA, HIROMI;ARAKAWA, SATORU
分类号 B24B37/005;B24B37/04;B24B37/30;H01L21/304 主分类号 B24B37/005
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