| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which junction between a metal plate and a semiconductor element is hardly peeled, and to provide a manufacturing method thereof. SOLUTION: The semiconductor device 10 is provided with a semiconductor element having front and rear surfaces; at least a pair of metal plates 12 respectively joined to the front and rear surfaces of the semiconductor element, and configuring an external electrode; and a sealing portion 14 provided so as to expose surfaces 12a opposite to junction surfaces of the pair of metal plates where the semiconductor element is joined, and cover the other portion. COPYRIGHT: (C)2008,JPO&INPIT
|
