发明名称 ELECTRONIC SUBSTRATE, ITS MANUFACTURING METHOD, AND ELECTRONIC APPARATUS
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an electronic substrate which can facilitate manufacture of an inductor element 40 having a plurality of windings 141 and 241 where the clearance of the windings 141 and 241 is filled with a nonmagnetic material 44 and the periphery of the windings 141 and 241 is covered with a magnetic material 43. <P>SOLUTION: The electronic substrate comprises a plurality of first interconnections 12 formed on a substrate 10, a second magnetic layer 31 formed continuously to cover the central portion of the plurality of first interconnections 12, and a plurality of second interconnections 22 formed to traverse the surface of the second magnetic layer 31. A second interconnection 122 is arranged to sequentially connect the end of one first interconnection 113 with the end of other first interconnection 114 which is not contiguous to the one first interconnection 113. An inductor element 40 has a plurality of windings 141 and 241 consisting of the first interconnections 12 and the second interconnections 22 wherein the clearance between adjoining windings 141 and 241 is filled with a nonmagnetic material 44 and the periphery of the inductor element is covered with a magnetic material 43. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2008103602(A) 申请公布日期 2008.05.01
申请号 JP20060286166 申请日期 2006.10.20
申请人 SEIKO EPSON CORP 发明人 HASHIMOTO NOBUAKI
分类号 H01L23/12;H01F5/00;H01F17/00;H01F41/04;H01L21/822;H01L27/04;H05K7/20 主分类号 H01L23/12
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