An apparatus for a molding of a semiconductor package is provided to prevent voids from being occurred in a molding resin when manufacturing the semiconductor package of high density and high capacity. An apparatus for a molding of a semiconductor package comprises a mold portion and a gate portion. The mold portion includes a first cavity(130a) and a second cavity(130b). The first cavity is a space, which encloses at least one semiconductor chip(110) and is filled with a molding resin. The second cavity is formed at a side of the first cavity and is a surplus space filled with the molding resin. The mold portion is composed of an upper mold portion(140a) and a lower mold portion(140b). The first cavity and the second cavity are defined by the lower mold portion. The molding resin injected to the first cavity passes through the gate portion. The gate portion defines a gate, which is an entrance space of the first cavity. A height of the second cavity is greater than that of the first cavity.
