CHEMICAL MECHANICAL POLISHING APPARATUS

摘要

A CMP apparatus is provided to avoid a process delay during a polishing process by preventing a wafer from being damaged by non-separation of the wafer in a process for unloading the wafer from the membrane of a polishing head to a pedestal of a transfer cup. A wafer is adsorbed to the lower end of a polishing head(120). A membrane(126) comes in contact with the surface of the wafer, formed in the lower end of the polishing head. The wafer is placed on a pedestal(142) included in a transfer cup(140). A nozzle(150) supplies fluid to a gap between the membrane and the wafer, mounted on the outer circumferential surface of the polishing head. The nozzle supplies the fluid during a process for unloading the wafer to the upper surface of the pedestal. A sensor(145) can be inserted into the upper surface of the pedestal, detecting whether the wafer is correctly placed on the pedestal.