发明名称 Resin composition, sheet-like formed body, prepreg, cured body, laminate, and multilayer laminate
摘要 <p>Provided is a resin composition, a prepreg, a cured body, a sheet-like formed body, a laminate, and a multilayered laminate using the resin composition, the resin composition including an epoxy resin and an inorganic filler. For example, when a second layer is formed onto the surface of a cured body, the cured body has improved adhesive property or adhesive property between the cured body and the second layer. A resin composition comprising an epoxy resin, a curing agent for the epoxy resin, a silica treated with an imidazole silane and having a mean particle diameter not more than 5 micrometers, the resin composition including the silica at a proportion of 0.1 to 80 parts by weight to a mixture consisting of the epoxy resin and the curing agent for the epoxy resin 100 parts by weight.</p>
申请公布号 GB0805043(D0) 申请公布日期 2008.04.23
申请号 GB20080005043 申请日期 2006.09.14
申请人 SEKISUI CHEMICAL CO. LTD. 发明人
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