| 摘要 |
A polymeric compound is provided to obtain an alkali-soluble resist material capable of lowering surface contact angle after development and inhibiting water permeation during immersion exposure, thereby realizing high-quality immersion lithography. A polymeric compound comprises repeating units represented by the following formulae (1a), (1b) and (1c), and has a weight average molecular weight of 1,000-500,000. In the formulae, each of R1a, R1b and R1c represents H, F or C1-C4 linear or branched alkyl or fluoroalkyl; R2a is H, -R3-CO2R7 or -R3-OR7; R2c is a C2-C20 linear, branched or cyclic fluoroalkyl; R3 is a divalent organic group containing fluorine or not; R4 is methylene or oxygen; R5 is H, CH3 or CF3; R6 is a C2-C20 linear, branched or cyclic fluoroalkyl; R7 is H, C1-C20 linear, branched or cyclic alkyl or fluoroalkyl, acid-liable group or adhesive group; and 0<=a<1, 0<b<1, 0<=c<1, and 0<a+b+c<=1.
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