| 摘要 |
A mounting method of superficially-mounted components on printed-circuit boards by means of vacuum pincers consists in that on the vacuum pincers vacuum is created, which value contributes to creation on the suction head of vacuum pincers of the force of suction, which is sufficient for reliable gripping and retention by vacuum pincers of superficially-mounted component, but which is less than the force of adhesion of the latter with flux or soldering paste, which cover on the printed-circuit board the areas of soldering this component, in this case each superficially-mounted component grasped by vacuum pincers is separated from the vacuum pincers in the place of installation of this component on the printed-circuit board due to the difference between the total force of adhesion of superficially-mounted component with the flux or soldering paste, which is present on the surface of printed-circuit board in the areas of soldering this component on the printed-circuit board, and suction force, which acts on this component from the side of the suction head of vacuum pincers. |
