发明名称 Method and device for attaching a label to blister packaging
摘要 <p>The method involves positioning a label (3) on a sub-area of a plastic film-molded part (1) of a blister package. The label is provided with a coating (4) made of a material that sticks by energy supply i.e. heat supply. The sticking effect of the coating is activated by the energy supply after the positioning of the label, and the label is pressed at the molded part during the activation of the sticking effect of the coating. The molded part is cooled and/or maintained in a room temperature. Independent claims are also included for the following: (1) a device for attaching a label to a blister package (2) a blister package comprising a three-dimensional shaped plastic film-molded part.</p>
申请公布号 EP1908691(A1) 申请公布日期 2008.04.09
申请号 EP20070019370 申请日期 2007.10.02
申请人 HEKUMA GMBH 发明人 STEPHAN, INGO
分类号 B65C9/25;B65C9/36 主分类号 B65C9/25
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