发明名称 |
HEAT DISSIPATING WIRING BOARD, METHOD FOR MANUFACTURING SAME, AND ELECTRIC DEVICE USING HEAT DISSIPATING WIRING BOARD |
摘要 |
It is an object to improve a conventional point that mounting an electronic component that requires a high current and heat radiation, such as an LED, together with other general electronic components on the same board has been difficult. To achieve this object, a different thickness lead frame partially having different thicknesses is used. On a thick portion of the different thickness lead frame, a special electronic component, such as an LED, for which a high current and heat radiation are required is mounted. Further, a thin portion of the different thickness lead frame is formed at a fine pitch, and general electronic components are mounted at a high density on the thin portion. Thus, unitization or modularization of electronic components for which a high current and heat radiation are required becomes possible. |
申请公布号 |
EP1909324(A1) |
申请公布日期 |
2008.04.09 |
申请号 |
EP20060810495 |
申请日期 |
2006.09.25 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
TSUMURA, TETSUYA;NISHIYAMA, HIROHARU;TSUJIMOTO, ETSUO |
分类号 |
H01L23/50;H01L23/373;H01L33/64;H05K1/02 |
主分类号 |
H01L23/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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