| 摘要 |
PROBLEM TO BE SOLVED: To provide a focus ring and a plasma processor for further improving uniformity within a surface of a plasma processing in comparison with conventional rings and processors. SOLUTION: The focus ring 5 is constituted with a first ring-shape member 5a formed of a conductive material and a second ring-shape member 5b formed of an insulating material. At an internal edge part of the first ring-shape member 5a, a stepped part 50 is formed at a lower position than the lower surface of a semiconductor wafer 30 placed on a setting board 2 and this stepped part 50 is extended toward the lower side of the circumferential edge part of the semiconductor wafer 30. The second ring-shape member 5b is arranged at the lower side of the first ring-shape member 5a to be located between the first ring-shape member 5a and the setting board 2. COPYRIGHT: (C)2008,JPO&INPIT
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