| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board manufacturing method for shortening a synthetic construction period and reducing a manufacture cost while a pattern and a pitch of printed wiring in the wiring board are made minute and they are mounted with high density. SOLUTION: The manufacturing method of the wiring board comprises a process for sticking a film 4 formed of a material on which patterning by irradiation of a laser beam 5 can be performed on a surface on copper foil 2 in an insulating substrate 1 to which copper foil 2 is stuck to a surface, a process for removing a part with which the laser beam 5 is irradiated to form the film 4 into a desired pattern by irradiating the film 4 with the laser beam 5, a process for using the pattern of the film 4 as etching resist and etching copper foil 2, and a process for peeling the film 4 after etching. COPYRIGHT: (C)2008,JPO&INPIT
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