| 摘要 |
A semiconductor package mold and a method for manufacturing a semiconductor chip package are provided to prevent leakage of a molding material and bending of a substrate by increasing pressure applied to the substrate using second support surfaces. A semiconductor package mold includes a first mold(210A) having a first cavity(V1) and a second mold(220A) having a second cavity(V2). A substrate(100) is interposed between the first and second molds, and has a first surface with a semiconductor chip(120), a second surface opposite to the first surface, and an opening(h) extending the first and second surfaces. The surface of the second mold extends from a second cavity surface(VS2) and the opening of the second surface of the substrate, and has plural support surfaces(VP) supporting the substrates.
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