MANUFACTURING METHOD OF LED PACKAGE, AND MANUFACTURING METHOD OF WHITE LIGHT SOURCE MODULE

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of an LED package capable of reducing the loss of light quantity and improving the light extraction efficiency.

SOLUTION: A manufacturing method of an LED package 100 includes the steps of forming a resin molding part 108 for sealing an LED chip 105; and applying a phosphor-containing coating agent to the surface of the resin molding part 108 by a conical and spiral spray pattern, in particular, with a spray coating method, and forming a phosphor thin film 120 on the surface of the resin molding part.

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