发明名称 |
MICRO ELECTRO-MECHANICAL SYSTEM MODULE PACKAGE CAPABLE OF MINIMIZING INTERFERENCE OF NOISES |
摘要 |
A MEMS module package includes a housing with an accommodation chamber and an opening in communication with the accommodation chamber. The housing has a substrate and an electrically insulative cap capped on the substrate and defining with the substrate the accommodation chamber therebetween. A micro electro-mechanical chip is installed on the substrate and located inside the accommodation chamber. The micro electro-mechanical chip has an action zone corresponding to the opening of the housing. A first conducting layer and a second conducting layer are respectively disposed on an inner surface and an outer surface of the electrically insulative cap.
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申请公布号 |
US2008079141(A1) |
申请公布日期 |
2008.04.03 |
申请号 |
US20070771019 |
申请日期 |
2007.06.29 |
申请人 |
LINGSEN PRECISION INDUSTRIES, LTD. |
发明人 |
TIEN JIUNG-YUE;TU MING-TE;HUANG CHIN-CHING |
分类号 |
H01L23/08 |
主分类号 |
H01L23/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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