| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a copper clad laminate for VOP with which a non-through via hole can be formed on a copper foil layer of a thin film capable of embodying a micro circuit pattern. SOLUTION: First and second copper foil layers 100, 120 are provided in which protecting layers 110, 130 are formed on one side and the first copper foil layer, an insulating layer 140 and the second copper foil layer are laminated in upper and lower parts around an adhesive layer 150. The protecting layer 130 formed on one side of the second copper foil layer is removed, a part of the second copper foil layer is removed and only the insulating layer is removed in an area where the second copper foil layer is removed, by laser working so as to form a via hole 170. The protecting film 110 formed on one side of the first copper foil layer and the adhesive layer 150 are removed to form two copper clad laminates 180. The protecting films formed on one side of each of the first copper foil layer and the second copper foil layer are laminated so as not to be in contact with the insulating layer 140. COPYRIGHT: (C)2008,JPO&INPIT
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