| 摘要 |
A fact curing adhesive composition, an adhesive tape for an electronic material obtained by using the composition, and a method for adhering the adhesive tape are provided to improve the adhesive properties to a polymer compound such as polyimide, polycarbonate, etc. and a metal or metal oxide such as aluminum, stainless, etc. at a high temperature. A fact curing adhesive composition comprises 45-52 wt% of the butadiene-acrylonitrile rubber represented by the formula 1; 2-3.5 wt% of the carboxyl acid compound represented by the formula 2; 23-29 wt% of a phenol-formaldehyde resin represented by the formula 3; and 23-29 wt% of a methenamine modified phenol-novolac resin represented by the formula 4, wherein n is 2-15. Preferably the butadiene-acrylonitrile rubber comprises 70-83 wt% of butadiene and 17-30 wt% of acrylonitrile. |
