| 摘要 |
A lead-exposed semiconductor device package may include a die pad; a semiconductor chip having bonding pads mounted on the die pad; a plurality of leads arranged to be adjacent to at least one edge of the die pad and to electrically connect external to the package; a locking member provided on the plurality of leads; bonding wires electrically connecting the bonding pads with the plurality of leads; and a molding material for sealing the semiconductor chip, the die pad, the plurality of leads, the locking member, and the bonding wires. The locking member may be configured to lock the plurality of leads to the molding material.
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