| 摘要 |
An epoxy resin composition for sealing an optical semiconductor is provided to retain inherent characteristics of epoxy resins, transmit visible rays, and interfere near infrared rays. An epoxy resin composition for sealing an optical semiconductor includes (A) an epoxy resin, (B) a hardener, and (C) a naphthalocyanine pigment. The component(C) has a structure represented by the following formula 1, wherein Rs are identical to or different from one another and represent a hydrogen atom, alkyl, alkoxy, alkylthio, arylthio, dialkylamino, nitro, phenyl, anilino, methylanilino, or N-phenyl-N-methylamino, n is an integer of 0-6, and M is a metal or metal oxide. |
