发明名称 FLUX FOR SOLDERING, AND SOLDER PASTE COMPOSITE
摘要 PROBLEM TO BE SOLVED: To provide a flux for soldering, which flux can sufficiently suppress the generation of cracks on a residue of the flux after soldering, and also has high reliability and excellent soldering performance, and is equivalent to a conventional flux in a manufacturing cost and an effect on environments, and further to provide a solder paste composite. SOLUTION: The flux for soldering contains low softening point rosin having a softening point of 60°C or low as a base resin. It is preferable that the low softening point rosin contains secodehydroabietic acid and/or thermolysis components of rosin, and the content of the secodehydroabietic acid and/or the thermolysis components is 5 wt.% or more of the low softening point rosin. Further, it is preferable that the content of the low softening point rosin is 0.5 to 80 wt.% of the total amount of the flux. The solder paste composite contains the flux and powder of a solder alloy. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008062242(A) 申请公布日期 2008.03.21
申请号 JP20060239288 申请日期 2006.09.04
申请人 HARIMA CHEM INC 发明人 CHIBA MASAYUKI;WATABE MASAHIRO;AIHARA MASAMI
分类号 B23K35/363;B23K35/22;H05K3/34 主分类号 B23K35/363
代理机构 代理人
主权项
地址
您可能感兴趣的专利