| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a connective terminal capable of preventing the reduction of a yield. <P>SOLUTION: The connective terminal 10 is used to so connect a semiconductor chip by solder in connecting a semiconductor chip 31 disposed on a lead frame 30 with another frame or another semiconductor chip. Further, it is the connective terminal having a connective-surface portion 12 with a connective surface narrower than the one of the semiconductor chip 31 for inducement of solder sucking-up. Moreover, it has a protective portion 13 larger than the one of the semiconductor chip and so has a connective portion 14 for connecting thereby the connective-surface portion and the protective portion as to cover the connective-surface portion with the protective portion while interposing a predetermined space therebetween. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
