| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a patterned structure and a pattern forming method by which a microscopic resist pattern having a high aspect ratio can be formed on a glass or film. <P>SOLUTION: The pattern forming method includes exposing and developing a photosensitive resist material 13B to form a patterned layer 15, wherein before a step of applying the photosensitive resist material 13B on a substrate 11, an underlayer 13A comprising the same or another photosensitive resist material is formed on the substrate. By preparing the underlayer 13A as a base for the patterned layer 15, adhesion between the substrate 11 and the patterned layer 15 is enhanced and the microscopic patterned layer 15 having a high aspect ratio can be formed. In order to enhance adhesion between the substrate 11 and the underlayer 13A, an adhesive layer 12 comprising HMDS (hexamethyldisilazane) is preferably interposed. <P>COPYRIGHT: (C)2008,JPO&INPIT |
