| 摘要 |
PROBLEM TO BE SOLVED: To obtain a thermal head which permits the height of a wire in a bonded portion to be reduced, and its wire bonding method. SOLUTION: The thermal head has a head board having a plurality of heating resistors and conductors conductively connected to the heating resistors and a circuit board equipped with a driving circuit controlling the passage of electricity to the heating resistors, and connects the conductors of the head board and the driving circuit of the circuit board by an Au wire. The head board and the circuit board are arranged side by side with the top face of the driving circuit located lower than the top face of the head board. The Au wire is folded and connected to ensure the height from the top face of the head board is highest above the circuit board side corner portion of the head board. COPYRIGHT: (C)2008,JPO&INPIT
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