| 摘要 |
<P>PROBLEM TO BE SOLVED: To lay out the mounting wiring efficiently at mounting by changing the constitution of a semiconductor device. <P>SOLUTION: A first and second chips 21, 22 are mounted on a first and second die pads 31, 32, respectively. The first and second die pads 31, 32 are divided and constituted in parallel to a first and second sides 41, 42 of a seal 40. This results in that an output pin 51 from the first chip 21 and a control pin 52 of a driving circuit may project in the opposite directions, and the wiring layout at mounting may be set to a minimum route. <P>COPYRIGHT: (C)2008,JPO&INPIT |
