发明名称 ONIUM-CONTAINING CMP COMPOSITIONS AND METHODS OF USE THEREOF
摘要 The present invention provides a chemical-mechanical polishing (CMP) composition suitable for polishing semiconductor materials. The composition has a pH of 5 or less and comprises colloidal silica, at least one onium compound selected from the group consisting of a phosphonium salt, a sulfonium salt, and a combination thereof, and an aqueous carrier therefor; A CMP method for polishing a surface of a semiconductor material utilizing the composition is also disclosed.
申请公布号 WO2008030576(A1) 申请公布日期 2008.03.13
申请号 WO2007US19570 申请日期 2007.09.07
申请人 CABOT MICROELECTRONICS CORPORATION 发明人 WHITE, MICHAEL;CHEN, ZHAN
分类号 C09K3/14 主分类号 C09K3/14
代理机构 代理人
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