发明名称 Heat dissipation device
摘要 A heat dissipation device includes a heat sink, a fan producing an airflow flowing towards the heat sink, an air-guiding member positioned between the fan and the heat sink and a cover enclosing the fan and the heat sink. The air-guiding member includes an air deflector dividing the airflow produced by the fan into two airstreams. The air deflector guides the airstreams of the airflow flowing towards different portions of the heat sink. By the air deflector, the portion of the heat sink, which is hotter than the other portion of the heat sink, has more air flowing therethrough.
申请公布号 US2008062641(A1) 申请公布日期 2008.03.13
申请号 US20060309849 申请日期 2006.10.12
申请人 FOXCONN TECHNOLOGY CO., LTD. 发明人 LAI CHENG-TIEN;LI TAO;TIAN WEI-QIANG
分类号 H05K7/20 主分类号 H05K7/20
代理机构 代理人
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