Method for electrically connecting a first substrate to a second substrate

摘要

The method involves positioning substrates (1, 2) on each other or adjacent to each other, and providing bonding wires (8) parallel to each other. Relative position of the substrates is changed to each other, and one of the substrates is displaced in longitudinal direction of the bonding wires and/or perpendicular to the other substrate. The bonding wires are elastically/plastically deformed during changing the relative position, and the former substrate is attached to the latter substrate after the relative position is changed.