| 摘要 |
A cleaning solution composition for forming the pattern of a semiconductor device is provided to improve the CD uniformity of a pattern and to prevent the collapse of a pattern. A cleaning solution composition comprises 0.02-5 wt% of a first surfactant which is a fatty acid alkanol amide-based surfactant; 0.02-5 wt% of a second surfactant which can aid the dissolution of the first surfactant; and water. Preferably the composition comprises further 0.2-10 wt% of at least one bacteria inhibitor selected from ethylene glycol, 2-methoxy-1-ethanol, propylene glycol, 1-methoxy-2-propanol, 1,2-butadiene, 1,2-pentanediol, 1,2-hexanediol, 1,2-heptanediol and 1,2-octanediol; and 0.2-20 wt% of at least one bubble inhibitor selected from butanol, pentanol, hexanol, heptanol, octanol, nonanol and decanol. |
