| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a movable structure body which is operated at a high speed with excellent machining accuracy with simple manufacturing processes. SOLUTION: The movable structure body is formed of an SOI substrate 100 composed of a first silicon substrate 10a and a second silicon substrate 10b which are bonded to each other. A movable plate 2 on which a porous silicon 15 is formed, a spring part 3 and vertical electrostatic combs 6 or the like are formed on the first silicon substrate 10a. The movable structure body is manufactured by: a first process in which the porous silicon 15 is formed by anode-oxidizing of the part, on which a movable plate 2 is formed, of the first silicon substrate 10a; a second process in which a second silicon substrate 10b is bonded to the first silicon substrate 10a; and a third process in which the movable plate 2 or the like is formed on the SOI substrate 100 formed in the second process. Thus etching or the like for a high step part, which is performed in a conventional method, is unnecessary, and the movable structure body is accurately manufactured with simple manufacturing processes. COPYRIGHT: (C)2008,JPO&INPIT
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