| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device suited for reducing a mounting area. <P>SOLUTION: The semiconductor device 1 comprises a multilayer wiring board 10 and a DC power source circuit 20. A semiconductor IC chip 30 is buried in the multilayer wiring board 10 provided with the DC power source circuit 20 which is for feeding a power voltage to the IC chip 30. <P>COPYRIGHT: (C)2008,JPO&INPIT |
