| 摘要 |
A method for connecting heat pipes and a heat sink comprises the steps of drilling a set of through holes through a heat dissipating base slab, implanting heat pipes through the through holes, integrating the heat-dissipating base slab with the heat pipes by punching using a press machine, and bending and twisting the heat pipes according to a predetermined angle and shape, whereby a set of radiation fins will be connected. The heat radiating device thereby produced is used on electronic elements.
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