发明名称 FOCUSED ION BEAM DEVICE AND SPECIMEN MACHINING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a focused ion beam device that allows machining and efficient observation of a specimen while securing machining accuracy even in machining of a large cross-section of an electronic component or the like, and a specimen machining method. SOLUTION: The focused ion beam device 1 is provided with a specimen table 2 on which a specimen M is placed; an ion beam emission means 4 which has a plurality of ion sources 24 for generating ions that become ion beams I1, I2, and I3, each extraction electrode 25 for extracting each ion beam I1, I2, and I3 from each ion source 24 by a voltage applied in-between each ion source 24, and each power supply that is capable of independently applying a voltage between each extraction electrode 25 and each of a plurality of the ion sources 24; and an ion beam optical system 5 that allows a plurality of the ion beams I1, I2, and I3 emitted from the ion beam emission means 4 to be focused on the specimen M. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008053003(A) 申请公布日期 2008.03.06
申请号 JP20060226868 申请日期 2006.08.23
申请人 SII NANOTECHNOLOGY INC 发明人 ADACHI TATSUYA;OGAWA TAKASHI;MINAFUJI TAKASHI;AIDA KAZUO;YASAKA KOJIN;SUGIYAMA YASUHIKO
分类号 H01J37/317;H01J37/30 主分类号 H01J37/317
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