| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an optical semiconductor device capable of being stably manufactured while being capable of reducing a manufacturing cost, and a manufacturing method for the optical semiconductor device. <P>SOLUTION: The optical semiconductor device A1 has a substrate 1, a pair of electrodes 2A and 2B, an LED chip 3, a bonding wire 4, and a resin package 5. In the optical semiconductor device A1, the thickness t1 of a section configuring a bonding pad 2Ba is set in 10 to 30 μm, and the thickness t2 of the section placed on the rear side of the substrate 1 is set in 5 to 9 μm in the electrode 2B with the bonding pad 2Ba. <P>COPYRIGHT: (C)2008,JPO&INPIT |
