| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device and a method of specifying a semiconductor chip which can easily specify a position on a semiconductor substrate obtained by a semiconductor chip. SOLUTION: The method includes a step where image data D1 that contain a residue of etched object formed on a surface side of a plurality of semiconductor chips by etching is obtained on each semiconductor chip, and the image data D1 is reserved correspondent to the position on the semiconductor substrate obtained by the semiconductor chip; a step where image data D2 that contain a residue of etched object formed on a semiconductor chip<SB>X</SB>(semiconductor chip to be specified) is obtained; and a step where the position on the semiconductor substrate obtained by the semiconductor chip<SB>X</SB>is specified on the basis of the image data D1, D2. COPYRIGHT: (C)2008,JPO&INPIT
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