发明名称 Sealed electronic component
摘要 An assembly for a sealed electronic component includes at least one electronic device mounted on a substrate, and a metal enclosure comprising first and second housing components that are welded together to define a sealed enclosure. The resulting assembly provides a reliable seal that eliminates the need for mechanical fasteners, adhesives, and equipment for applying and curing adhesives.
申请公布号 US2008053700(A1) 申请公布日期 2008.03.06
申请号 US20060516195 申请日期 2006.09.06
申请人 O'CONNOR KURT F;LAWLYES DANIEL A;LAUDICK DAVID A;GERTISER KEVIN M 发明人 O'CONNOR KURT F.;LAWLYES DANIEL A.;LAUDICK DAVID A.;GERTISER KEVIN M.
分类号 H01L23/02 主分类号 H01L23/02
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